NIIR

Contents

1. Electrochemical Processing 1.1. Introduction 1.2. The Electrochemical Cell 1.3. Inorganic 1.3.1. Hardware for Electrochemical Processing 1.4. Production Conditions 1.4.1. Electrolysis of Chloride Solutions 1.4.2. Organic 1.5. Hardware For Electro-Organic Processing 1.5.1. Cells 1.5.2. Electrodes 1.5.3. Electrolytes 1.5.4. Diaphragms 1.5.5. Cell Designs 1.5.6. Scale-Up-Consideration 2. Metal Surface Treatments 2.1. Cleaning, Pickling, And Related Processes 2.1.1. Cleaning 2.1.2. Solvent Cleaning 2.1.3. Wiping 2.1.4. Emulsifiable Solvents 2.1.5. Emulsion Cleaning 2.1.6. Diphasic Chlorinated Solvents 2.1.7. Vapour Degreasing 2.1.8. Ultrasonic 2.1.9. Alkaline 2.1.10. Immersion 2.1.11. Spray 2.1.12. Ultrasonic Alkaline 2.1.13. Steam 2.1.14. Electrocleaning 2.1.15. Pickling 2.1.15.1 Chemical for Pickling Sulphuric Acid Hydrochloric Acid Nitric Acid Phosphoric Acid Chromic Acid Hydrofluoric Acid 2.1.15.2. Other Pickling Acid 2.1.15.3. The Practice of Electrolytic Pickling 2.2. Chemical and Electrolytic Pickling Compared 2.2.1. Anodic Cathodic Pickling Compared 2.2.2. Tin and Lead Additions 2.2.3. Regeneration of Pickling Solutions 2.2.4. Pickling Before Electroplating 3. Electrolytic Machinery Methods 3.1. Principles of The Ecm Process 3.1.1. The Solution Gap 3.1.2. Electrolytes 3.1.3. Temperature Effects 3.1.4. Corrosion Products 3.1.5. Pressure Effects 3.2. Types of Ecm Operations 3.3. Modern Development of the Ecm Process 3.3.1. Electrolyte Development 3.3.2. Fundamental Investigation 3.3.3. Innovations in ECM Operation 3.3.3.1. Static Fixture Finishing and Sizing 3.3.3.2. Embossing 3.3.3.3. Broaching 3.3.3.4. Uses 4. Electroless Plating 4.1. Theory 4.1.1. Plating Tanks 4.1.2. Rack Design and Loading Factors 4.1.3. Safety and Waste Disposal 4.1.4. Plating on Metals 4.1.5. Preparation of the Substrate 4.1.6. Plating on Nonconductors 4.1.7. Plating of Plastics 4.1.8. Process Details 4.1.9. Printed Circuits 4.1.10. Printed-Circuit Etchants 4.1.11. Emerging Printed-Circuit Technologies 4.1.12. Plating on Glass 4.1.13. Architectural Glass 4.1.14. Ceramic Plating 4.1.15. Composite Plating 4.2. Electroless Composite Coatings 4.3. Uses And Applications 4.4. Nonelectrolytic Plating Processes 4.4.1. Immersion Plating 4.4.2. Autocatalytic Plating 4.5. Postplating Treatments 4.6. Specification and Tests 4.6.1. Thickness 4.6.2. Corrosion Resistance 4.6.3. Adhesion 4.7. Applications 4.7.1. Decorative Plating 4.7.2. Plating for Protection 4.7.3. Special Surface Effects 4.7.4. Engineering Applications 4.7.5. Electroforming 5. Electroplating 5.1. The Substrate In Electroplating 5.2. Preparation of the Substrate 5.2.1. Cleaning 5.2.2. Rinsing 5.2.3. Acid Dipping 5.2.4. Drag-Out and Drag-In 5.2.5. Special Preparation Cycles 5.2.6. Aluminium and Magnesium 5.2.7. Zinc-Base Die Castings 5.2.8. Refractory Metals 5.2.9. Other Metals 5.2.10. Nonconductors 5.3. The Electroplating Process 5.3.1. Continuous Plating 5.3.2. Materials of Construction 5.3.3. Economics 5.3.4. Safety 5.3.5. Waste Disposal and Metal Recovery 5.4. Plating Solutions 5.4.1. Current Density Range 5.4.2. Throwing Power 5.4.3. Acidity 5.4.4. Anodes 5.4.5. Temperature 5.4.6. Purity 5.4.7. Bright Plating 5.4.8. Maintenance of Plating Baths 5.5. Individual Plating Baths 6. How to Start an Electroplating Business 6.1. Research and Market Analysis 6.2. Develop a Business Plan 6.3. Legal Compliance and Permits 6.4. Find an Appropriate Location 6.5. Purchase the Necessary Equipment 6.6. Develop Processes and Protocols 6.7. Build a Team 6.8. Marketing and Branding 6.9. Quality Assurance 6.10. Financial Management 7. Electroplating Plant 7.1. Plant Requirements 7.1.1. Buildings 7.1.2. Supporting the Work to be Plated 7.1.3. Tanks 7.1.4. Filtration 7.1.5. Air Agitation 7.1.6. Water Supply 7.1.7. Heaters 7.1.8. Maintenance of the Solution 7.1.9. Effluent 7.2. Electroplating Plant 8. Electroplating of Aluminium 8.1. Surface Roughening 8.2. Anodising 8.3. Zincating 8.4. Alstan Process 8.5. Plating Process 9. Electroplating of Cadmium 9.1. The Solution 9.2. Additions to the Solution 9.3. Anodes 9.4. Thickness of Deposit 9.5. Operating Conditions 9.6. Anti-Corrosion Properties of Cadmium 9.7. Nickel on Cadmium 9.8. Heat Treatment of Cadmium Deposits 9.9. Cadmium and Food Stuffs 9.10. Bright Cadmium Plating 9.11. Applications of the Cadmium-Plating 10. Electroplating of Chromium 10.1. The Electrolyte 10.2. Chromium Plating Process 10.3. Regeneration of Chrome Plating Solutions 10.4. Coloured Chromium Plating 10.5. Chromium Plating on Aluminium 11. Electroplating of Cobalt 11.1. Principles 11.2. Functions of Constituents of Bath 11.3. Operating Conditions 11.4. Maintenance and Controls 11.5. Preparation of Basis Metals and Finishing of Deposits 11.5.1. Tests of Deposits 12. Electroplating of Copper 12.1. Copper Sulphate Plating Bath 12.1.1. Operating Condition 12.2. Bright Plating 12.3. Cyanide Bath 12.3.1. Composition 12.4. Sodium Formulation 12.4.1. Operating Condition 12.5. Potassium Formulations 13. Electroplating of Gold 13.1. Stripping Gold 13.2. Gold Baths 13.2.1. Bath for Gold Gilding 13.2.2. Current-Density, 0.15 Ampere 13.3. Gold Baths For Hot Gilding 13.3.1. Tanks for Gold Baths 13.3.2. Execution of Gold-Plating 13.4. For Gold-Plating in The Cold Bath the Process is as Follows 13.4.1. Re-Gilding 13.4.2. Application of Gold-Deposition 13.5. Gold Thread 13.5.1. Process 13.6. Gold Plating of Stainless Steel Ornament 13.6.1. Methods of Plating Stainless Steel 13.6.2. Plating Procedures 14. Electroplating of Iron 14.1. Principles 14.2. The Iron Chloride Bath 14.3. The Iron Sulphate Bath 14.4. The Fluoborate Bath 15. Electroplating of Lead 15.1. Analysis of Lead Solution 15.1.1. Free Acid 15.2. Applications of Lead Plating 16. Electroplating of Nickel 16.1. Types of Ni Solutions 16.1.1. Engineering Application 16.2. Ni And Ur Plating Butterworths 16.2.1. Electroplating Baths used 16.2.1.1. Watts Nickel Bath 16.2.1.2. Hard Watts Bath 16.2.1.3. Nickel Sulphate Bath 16.2.1.4. Nickel Sulphonate Bath 16.2.1.5. Nickel Fluoborate Bath 16.2.1.6. Barrel Nickel Plating 16.2.1.7. Black Nickel 16.2.1.8. Black Ni Plating Processes 16.3. Types of Nickel Plating Solutions Used 17. Electroplating of Bright Nickel 17.1. Carriers 17.1.1. Auxiliary Brightners 17.2. Nickel Electroplating Brighteners 18. Electroplating of Silver 18.1. Silver (Atomic weight=107.88) and Its Properties 18.2. Silver Bath for a Heavy Deposit of Silver (Silvering by Weight) 18.3. Preparation of Bath I, With Silver Chloride 18.4. Preparation of Bath II with Silver Cyanide 18.5. Silver Bath for Ordinary Electroplating 18.5.1. Tanks for Silver Baths 18.6. Execution of Silver-Plating 18.6.1. Silver Plating by Weight 18.7. Bright Silver Plating 18.7.1. Source of Brightening in Carbon Disulphide Electrolytes 19. Electroplating of Alloy 19.1. Electrodeposition of Zinc-Iron Alloy 19.2. Lead-Tin Plating 19.3. Speculum Plating 19.4. Gold Alloy Plating 19.5. Bright Alloy Plating 19.6. Ni-Alloy Plating 19.7. Bronze Plating 19.8. Copper Solution 20. Electroplating of Platinum 20.1. Keital and Zschiegner Process 20.2. Powell and Scott Process 20.3. Conditions of Operation 20.4. Maintenance of Electrolyte 21. Electroplating of Palladium 21.1. Soluble Anode Process 21.1.1. Condition of Operation 21.1.2. Properties of the Deposit 21.2. Diaphragm Process 21.2.1. Condition of Operation 22. Electroplating of Rhodium 22.1. pretreatment 22.2. Predeposition 22.2.1. Palladium Plating 22.3. Solution Agitation 22.4. Rhodium Plating 22.4.1. Tank 22.4.2. Tank Installation 22.4.3. Solution Heating 22.4.4. Rectifier 22.4.5. Rectifier Control 22.4.6. Current Control 22.4.7. Temperature Control 22.4.8. Making of Rhodium Plating Bath 22.5. Rhodium 22.5.1. Method A—Colorimetric 22.5.1.1. Discussion of the Method 22.5.2. Method B 22.5.2.1. Discussion of the Method 22.5.3. Method C—Hydrazine Reduction 22.5.3.1. Discussion of the Method 22.6. Sulphate 22.7. Applications of the Precious Metals 23. Electroplating of Bright Zinc 23.1. Bright Zinc-plating Processes 23.1.1. Chemical Control 23.1.2. Electrolytic Impurities 23.1.3. Anodes 23.2. Advantages of Bright Zinc Plating 24. Electroplating of Tin 24.1. Introduction 25. Electroplating of Plastics 25.1. The Plating of Plastics and Non-metallic Materials 25.1.1. Polishing with Plumbago 25.1.2. Metallising with Copper Bronze Powder 25.1.3. Metallisation by Molten Metal Spraying 25.1.4. Metal Surfacing of Ceramics by “Firing” 25.1.5. Vacuum Evaporation and Electrical Sputtering 25.1.6. Silver Mirror Process as Applied to Plastics 25.1.6.1. Removal of Glaze 25.1.6.2. Cleaning 25.1.6.3. “Sensitising”—The next step is to 25.1.6.4. Silvering 25.1.6.5. Coppering 25.1.6.6. Silver Recovery 26. Electroplating of Barrel 26.1. Barrel Nickel-Plating 26.1.1. Barrel Coppering 26.1.2. Brass Barrelling 26.1.3. Barrel Cadmium 26.1.4. Barrel Zinc 26.1.5. Barrel Silver 26.1.6. Electro-Galvanising Tray 26.1.7. Barrel Polishing 26.1.8. Barrel Tin 26.2. Applications 27. Zinc Electroplating Brightener 27.1. Uses and Applications 27.2. Properties of the Brightener 27.3. Formulations 27.4. Operating Conditions 27.4.1. Temperature 27.4.2. Current Efficiencies 27.4.3. Throwing Power 27.4.4. Conductivity and polarization 27.5. Manufacturing Process 27.6. Formulation 28. Metal Treatments 28.1. Mechanical Treatments 28.1.1. Workability Testing 28.1.2. Plastic Deformation 28.1.3. Hot Working 28.1.4. Cold working 28.1.5. Primary Forming Processes 28.1.6. Secondary Forming Processes 28.2. Thermal Treatments 28.2.1. Annealing 28.2.2. Heat Treatment of Steel 28.2.3. Homogenization 28.2.4. Thermo mechanical Processing 28.3. Recent Development and Outlook 28.3.1. Powder Metallurgy of Superalloys 29. Electrodeposition of Precious Metals 29.1. Physical Properties 30. Electropolishing of Stainless Steel 30.1. Application 30.1.1. Baths 30.2. Experimental 30.2.1. Bath Composition 30.2.2. Hull Cell Studies 30.2.3. Rates of Dissolution 30.2.4. Effect of Polishing Time 30.2.5. Life of the Bath 30.3. Practice of Electropolishing 30.3.1. Sequence of Operations 30.3.2. Mechanical and Chemical Pretreatment 30.3.3. Electropolishing 30.3.4. Treatments After Electropolishing 30.3.5. Equipment for Electropolishing 30.3.6. Technical and Economic Aspects 30.4. Applications of Electropolishing 30.4.1. Decorative Finishing 30.4.2. Polishing of Parts Exposed to Friction 30.4.3. Electropolishing Cutting Tools 30.4.3.1. Drills and Taps 30.4.3.2. Wood Working Tools 30.4.3.3. Solutions Employed 30.4.4. Polishing of Measuring Instruments 31. Case Hardening 31.1. Processes 31.1.1. Carburizing 31.1.2. Gas 31.1.3. Liquid 31.1.4. Pack 31.1.5. Carbonitriding 31.1.6. Gas 31.1.7. Cyaniding 31.1.8. Nitriding 31.1.9. Gas 31.1.10. Liquid 31.1.11. Microcasing 31.1.12. Ionitriding 31.1.13. Siliconizing 31.1.14. Boronizing 31.1.15. Tufftriding 31.1.16. Triniding 31.1.17. Applied Energy 31.1.18. Induction Hardening 31.1.19. Flame Hardening 31.1.20. Other 31.1.21. Hardening 32. Electroless Coating of Gold, Silver 32.1. Methods for Mirroring 32.1.1. Electroless Process 32.2. Equipment 32.3. Silver Colouring for Mirror (Silver Coating) 32.3.1. Formulation-1 32.3.1.1. Preparation 32.3.2. Formulation-2 32.3.2.1. Preparation 32.4. Process of Manufacture 32.4.1. Selection of glass sheet 32.4.2. Cleaning of glass sheet 32.4.3. Sensitizing 32.4.4. Silvering on glass 32.5. Plating Procedure 32.6. Silvering of Glass 32.6.1. Chemical Silvering 32.6.2. To Prepare the Bath 32.6.3. Cleaning 32.7. Gold Colouring for Mirror (Gold Coating) 32.8. Formulations for Electroless Gold Bath 32.9. Manufacturing Process for Gold Plating 32.10. Blue Silvering on Glass with Copper Coating 32.11. Formulation of Blue Silvering on Mirror 32.12. Manufacturing Process 32.13. Copper Coating 32.14. Plating Bath Formulation 32.14.1. Bath Constituents 32.15. The Operation of Electroless Copper Baths 32.16. Red Mirror by Electroless Dipping Method 32.16.1. Electroless Copper Plating of Plain Glass to Manufacture Red Mirror 32.17. Manufacture Process of Red Mirror 32.18. Test for Electroless Plated Red Mirror Adhesion 32.18.1. Baking Test 32.18.2. Burnishing Test 32.19. Test for Continuity 32.19.1. Ferroxy Test 32.20. Marking 33. Buffing and Industrial Metal Polishing Compounds 33.1. Abrasives for Buffing 33.1.1. Tripoli 33.1.2. Vienna Lime 33.1.3. Aluminium Oxide (Sophire) 33.1.4. Rouge 33.1.5. Amorphous Crystalline Silica 33.1.6. Emery 33.2. Buffing & Polishing Compositions 33.3. Manufacturing Method of Buffing Compounds 33.4. Carborundum for Polishing 34. Gold and Its Compounds 34.1. Mineralogy 34.2. Metallurgy 34.3. Cyanide Process 34.4. Purification 34.5. Properties 34.6. Chemical 34.7. Technology 34.8. Electroplating 35. Complex Salts of Copper, Silver and Gold 35.1. Complex compounds of Silver 35.2. Complex Salts of Gold 36. Aluminium and Its Compounds 36.1. Mineralogy 36.2. Extraction 36.3. Metallurgy 36.4. Properties 36.5. Chemical 36.6. Technology 36.7. Aluminium Chloride, AlCl3 36.8. Properties 36.9. Potash Alum, K2SO4. AI2(SO4)3. 24H2O 36.10. Amalgam Metallurgy 37. Hydrides of Silicon 37.1. Silicon Tetrahydride, Silicane, or Monosilane, SiH4 37.1.1. Preparation 37.1.2. Properties 37.2. Silicoethane, Disilicane,Disilane, Si2H6 37.2.1. Preparation 37.2.2. Properties 37.3. Silicopropane, Trisilicane or Trisilane, Si3H3 37.3.1. Preparation 37.3.2. Properties 37.4. Silicobutane, Tetrasilicane or Tetrasilane, Si4H10 37.5. Silicopentane, Si5H12 and Silicohexane, Si6H14 37.6. Silico-acetylene, (Si2H2)n 37.7. Structural Considerations 37.8. Short Note on Silicones 37.8.1. Manufacture of Silicone 37.8.2. Direct Method 37.8.3. Direct Method 37.8.4. Technology 38. Chemical and Electrochemical Conversion Treatments 38.1. Phosphating 38.1.1. Coating Formation 38.1.2. Process Parameters 38.1.3. Uses 38.2. Anodizing 38.3. Metal Colouring 38.4. Energy Considerations 39. Electrostatic Sealing 39.1. Theory 39.2. The Technique 39.3. Seal Properties 39.4. Use 40. ASTM Standards 41. BIS Standards 42. British Standards 43. ISO Standards 44. Factory Layout and Process Flow Chart & Diagram 45. Photographs of Plant and Machinery with Suppliers Contact Details Filtration Unit Electroplating Barrel Preheater for Extrusion Automatic Centrifugal Dryer Eletroplating Rectifier Chemical Filter Centrifugal Polishing Machine Polishing Barrel Drum Electroplating Tank Vibratory Finishing Machines Fully Automatic Electroplating Plants Wet & Dry Scrubbers Blowers Hot Dip Tin Coating Electroplating Dryers ETP and Centrifugal Blowers Acid Fume Scrubber Wire Electro Plating Plant (Tin/Copper/Nickel/Silver) Hot Air Generator Air Agitation Units Horizontal Polishing Barrel Electroplating Air Cooled Rectifier Air Pollution Scrubber System Automatic Dip Spin Coating Machine Effluent Treatment Plant

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